eprintid: 1361441
rev_number: 27
eprint_status: archive
userid: 608
dir: disk0/01/36/14/41
datestamp: 2012-09-13 20:20:20
lastmod: 2020-02-12 17:41:16
status_changed: 2012-09-13 20:20:20
type: article
metadata_visibility: show
item_issues_count: 0
creators_name: Hadzifejzovic, E
creators_name: Elahi, A
creators_name: Caruana, DJ
title: Control of oxidation state of copper in flame deposited films
ispublished: pub
divisions: UCL
divisions: A01
divisions: B04
divisions: C06
divisions: F56
keywords: Copper, Thin films, Flame deposition, Oxidation state, X-ray diffraction, Raman spectroscopy
note: This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY), which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.
abstract: The deposition of thin copper based films onto carbon steel surface is described, using premixed flames with different oxygen/methane ratios doped with aqueous copper nitrate as precursor. We investigated the chemical properties of the copper as a function of oxygen/methane ratio. Using fuel rich flames (equivalence ratio 0.665), the deposited copper film was entirely metallic. When the equivalence ratio was increased to 0.850 or greater the copper film contained predominantly Cu2 +. Furthermore, the flame can be used for post deposition modification, as demonstrated by reduction of Cu2 + containing films to Cu metal. All the films were characterised by X-ray diffraction, Raman and scanning electron microscopy (SEM). A rotating sample holder was employed to avoid over heating of the sample and the critical variables such as sample height in the flame and deposition time were optimised. Deposition for 20 min, which translated to a total residence time in the flame of approx. 76 s, produces metallic copper films of thickness 169 ± 18 nm as determined by anodic stripping and SEM. The microstructure of the metallic films was clearly composed of fused copper spheres of 100–150 nm, which are probably formed in the flame and subsequently deposited on the surface with good adhesion.
date: 2012-06-01
official_url: http://dx.doi.org/10.1016/j.tsf.2012.03.055
vfaculties: VMPS
oa_status: green
language: eng
primo: open
primo_central: open_green
verified: verified_manual
elements_source: WoS-Lite
elements_id: 437856
doi: 10.1016/j.tsf.2012.03.055
lyricists_name: Caruana, Daren
lyricists_id: DJCAR76
full_text_status: public
publication: THIN SOLID FILMS
volume: 520
number: 16
pagerange: 5254 - 5259
issn: 0040-6090
citation:        Hadzifejzovic, E;    Elahi, A;    Caruana, DJ;      (2012)    Control of oxidation state of copper in flame deposited films.                   THIN SOLID FILMS , 520  (16)   5254 - 5259.    10.1016/j.tsf.2012.03.055 <https://doi.org/10.1016/j.tsf.2012.03.055>.       Green open access   
 
document_url: https://discovery-pp.ucl.ac.uk/id/eprint/1361441/1/1361441.pdf