Gill, Atal; Ghoreishizadeh, Seyedeh; (2023) Advances in nanomaterials integration in CMOS-based electrochemical sensors: a review. IEEE Sensors Journal (In press).

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Abstract

The monolithic integration of electrochemical sensors with instrumentation electronics on semiconductor technology is a promising approach to achieve sensor scalability, miniaturization and increased signal to noise ratio. Such an integration requires post-process modification of microchips (or wafers) fabricated in standard semiconductor technology (e.g. CMOS) to develop sensitive and selective sensing electrodes. This review focuses on the post-process fabrication techniques for addition of nanomaterials to the electrode surface, a key component in the construction of electrochemical sensors that has been widely used to achieve surface reactivity and sensitivity. Several CMOS-compatible techniques are summarized and discussed in this review for the deposition of nanomaterials such as gold, platinum, carbon nanotubes, polymers and metal oxide/nitride nanoparticles. These techniques include electroless deposition, electro-chemical deposition, lift-off, micro-spotting, dip-pen lithography, physical adsorption, self-assembly and hydrothermal methods. Finally, the review is concluded and summarized by stating the advantages and disadvantages of these deposition methods.

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